THERMAL MANAGEMENT AND VENTILATION
Accumulated heat is the main factor of degradation in industrial electronics. We design enclosures that act as passive thermal management systems by calculating the strategic placement of vents and ducts to maximize heat dissipation without compromising mechanical protection or the structural rigidity of the piece.
Optimized airflow and active dissipation.
We implement ventilation patterns and fan housings directly into the print geometry, leveraging the thermal stability of PETG to prevent warping due to hot spots. By focusing on the value in the CAD design, we ensure that the structure itself facilitates natural convection, guaranteeing that your hardware always operates within safe thermal ranges without the need for additional mounting components.
